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          1. NITTO TRM-6250L QFN膠帶 IC樹脂密封保護
            起批量(平方米 價格
            50-500 ¥168.5元/平方米
            ≥500 ¥152.5元/平方米
            • 供貨能力:38498
            • 最低訂購量:50平方米
            • 可銷售總數量:100000平方米
            • 建議零銷價:180元/平方米
            • 發布日期: 2017-06-12
            • 更新日期: 2019-12-08
            產品詳細說明
            產地/產商: 深圓/一中 透氣性:
            主要材料: PI 厚度: 0.031 mm
            用途: 芯片封裝 拉伸性能: 35%
            型號: YZ-5825 寬度: 500 mm

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            NITTO TRM-6250L QFN膠帶 IC樹脂密封保護


            PW/TRM series are products which combines Nitto Denko's advanced adhesion controlled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes. With the wide variety of outstanding heat resistant characteristics, PW/TRM series can be applied to temporary fixing and masking in heating processes, and can be used for protection and transport of film components. The adhesives can be chosen from acrylic-based adhesives and other silicon-based adhesives, suitable for heating applications, to meet customer needs.


            Features

            ·         Outstanding heat resistance.

            ·         Optimum for temporary fixing and masking in heating processes, and for protection and transport of film components.

            ·         Suitable adjustments can be made for processed products

            TRM Series

            Product No.

            Adhesive

            Backing

            Total thickness [without    liner] [μm]

            Release liner

            Adhesive strength    [N/20mm]

            TRM-3650S

            Silicone

            Polyimide film #25

            31

            Polyester film #50

            0.3

            TRM-6250L

            Silicone

            Polyimide film #25

            31

            Polyester film #50

            0.5

            [Remarks] 

            ·     *Adherend: SUS plate, 2kg roller b, passes back and forth once, 5mm/sec, peeling speed 300mm/min, 180° angle

            Strucuture

            Applications

            ·         Carrier: Support for thin-layer materials and protection during transport

            ·         Temporary fixing: Temporary fixing manufacturing processes riring high-temperature

            ·         Masking: Masking for package manufacturing processes

            ·         Surface protection: Protection of CCD glass

            ·         Dam: Prevents resin leakage when molding semiconductor packages and electronic components

            Cautions

            ·         Please avoid skin contact, as this could cause rashes.

            ·         Please refer to a certified disposal company for safe disposal. (Do not incinerate as this may produce toxic gas or odors that can cause nausea if inhaled.)


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